Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s.
Direct bonding, or fusion bonding, describes a waferbonding process without any additional intermediate layers. The bonding process is based on chemical...
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a waferbonding technique with an intermediate glass layer. It...
cell is not thick enough. Waferbonding is the most popular method. In this method, a CMUT is built from two separate wafers, which are later bonded to...
is used to facilitate waferbonding; and eutectic bonding, wherein a thin-film layer of gold is used to bond two silicon wafers. Each of these methods...
to seal glass to silicon wafers in electronics and microfluidics. This bonding technique, also known as field assisted bonding or electrostatic sealing...
Eutectic bonding, also referred to as eutectic soldering, describes a waferbonding technique with an intermediate metal layer that can produce a eutectic...
Adhesive bonding (also referred to as gluing or glue bonding) describes a waferbonding technique with applying an intermediate layer to connect substrates...
annealing to create a buried SiO 2 layer. Waferbonding – the insulating layer is formed by directly bonding oxidized silicon with a second substrate....
Thermocompression bonding describes a waferbonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding...
stacking components, which are joined temporarily in a similar fashion Waferbonding. Marin Alexe, U. Gösele. Page 5 Google books More rapidly than 1/distance2...
The waferbond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without...
Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is...
highly dependent on the package type. IC bonding Wire bonding Thermosonic Bonding Down bonding Tape automated bonding Flip chip Quilt packaging Film attaching...
containing nanoparticles, electrodeposition, and a technique inspired by wafer-bonding. The Se supply and selenization environment is important in determining...
activated bonding (SAB) is a non-high-temperature waferbonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by...
chips are then cut out of the wafer and attached to their carriers, typically via wire bonding such as thermosonic bonding. These wires eventually lead...
PCMCIA card or waferbonding and stacking, this can also occur during wafer dicing, in a process known as Dice Before Grind or DBG) Waferbonding and stacking...
Wafer testing is a step performed during semiconductor device fabrication after the back end of line (BEOL) process is finished. During this step, performed...
adhesive strength that can be greatly reduced through UV irradiation. Waferbonding Lei, Wei-Sheng; Kumar, Ajay; Yalamanchili, Rao (2012-04-06). "Die singulation...
Reactive bonding describes a waferbonding procedure using highly reactive nanoscale multilayer systems as an intermediate layer between the bonding substrates...
T. Imoto, M. Matsui and C. Takubo developed a "System Block Module" waferbonding process for manufacturing 3D integrated circuit (3D IC) packages. The...
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