This article is about the final stage in the manufacturing process of integrated circuits. For an article about the physical enclosure that surrounds integrated circuits, see Semiconductor package.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.
The packaging stage is followed by testing of the integrated circuit.
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"package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the integrated circuit...
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references. Semiconductor packageIntegratedcircuitpackagingPackaging (disambiguation) Packaging Michael Pecht et al, Electronic Packaging Materials and Their...
The soviet integratedcircuit designation is an industrial specification for encoding the names of integratedcircuits manufactured in the Soviet Union...
The first planar monolithic integratedcircuit (IC) chip was demonstrated in 1960. The idea of integrating electronic circuits into a single device was born...
surface-mount technology packages for integratedcircuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the...