Technique that flips a microchip upside down to connect it
This article is about the semiconductor mounting technique. For the DEC PDP module, see Flip Chip (PDP module). For the CPU format, see Flip-chip pin grid array.
Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the silicon die appears dark blueUnderside of a die from a flip chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip chip mounting are visible
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4,[1] is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York.[2] The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect the chip pads to external circuitry.[3]
^E. J. Rymaszewski, J. L. Walsh, and G. W. Leehan, "Semiconductor Logic Technology in IBM", IBM Journal of Research and Development, 25, no. 5 (September 1981): 605.
^Filter Center, Aviation Week & Space Technology, September 23, 1963, v. 79, no. 13, p. 96.
^Peter Elenius and Lee Levine, Chip Scale Review. "Comparing Flip-Chip and Wire-Bond Interconnection Technologies". July/August 2000. Retrieved July 30, 2015.
Flipchip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices...
PGA packages use wire bonding when the chip is mounted on the pinned side, and flipchip construction when the chip is on the top side. Some PGA packages...
An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic...
device) with the conductive traces of the printed circuit board. In "flipchip on board", the device is inverted, with the top layer of metallization...
LGA 7529 is an upcoming zero insertion force flip-chip land grid array (LGA) socket designed by Intel that will be used by the future Sierra Forest, a...
the "micro-FCBGA" (flipchip ball grid array) is Intel's current[when?] BGA mounting method for mobile processors that use a flipchip binding technology...
array, chip-scale package, and flipchip packages generally use solder balls. After the solder balls are used to attach an integrated circuit chip to a...
embedded in flipchip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flipchip packaging...
Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Advanced Micro Devices (AMD) that is used for AMD...
LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake...
connections to a substrate without an intermediate header or carrier. In flipchip systems the IC is connected by solder bumps to a substrate. In beam-lead...
to manufacture. Wire bonding can be used instead of techniques such as flip-chip to reduce costs. Early integrated circuits were packaged in ceramic flat...
LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy...
LGA 1200 is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake...
ASE began volume production of wafer-level chip-scale packages. Flipchip is a method of flipping the chip to connect with either substrate or leadframe...
LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell...
interface found on older AMD and Intel processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch protruding...
LGA 1151, also known as Socket H4, is a type of zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in...
circuits were then packaged as the first "R" (red) series "Flip-Chip" modules. Later, other Flip-Chip module series provided additional speed, much higher logic...
LGA 4677 (Socket E) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and...
for the HX series, the processor and PCH are packaged together on a multi-chip package. The HX series uses 45x37.5mm BGA 1964, and the other mobile processors...
system include soldering, wirebonding, or flipchip mounting. Contact pads are created alongside a chip's functional structure during the photolithography...
models comprise two dies, each containing two cores, packaged in a multi-chip module. The Core 2 range was the last flagship range of Intel desktop processors...
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