Anodic bonding is a wafer bonding process to seal glass to either silicon or metal without introducing an intermediate layer; it is commonly used to seal glass to silicon wafers in electronics and microfluidics. This bonding technique, also known as field assisted bonding or electrostatic sealing,[1] is mostly used for connecting silicon/glass and metal/glass through electric fields. The requirements for anodic bonding are clean and even wafer surfaces and atomic contact between the bonding substrates through a sufficiently powerful electrostatic field. Also necessary is the use of borosilicate glass containing a high concentration of alkali ions. The coefficient of thermal expansion (CTE) of the processed glass needs to be similar to those of the bonding partner.[2]
Anodic bonding can be applied with glass wafers at temperatures of 250 to 400 °C or with sputtered glass at 400 °C.[3] Structured borosilicate glass layers may also be deposited by plasma-assisted e-beam evaporation.[4]
This procedure is mostly used for hermetic encapsulation of micro-mechanical silicon elements. The glass substrate encapsulation protects from environmental influences, e.g. humidity or contamination.[2] Further, other materials are used for anodic bonding with silicon, i.e. low-temperature cofired ceramics (LTCC).[5]
^Cite error: The named reference WP1969 was invoked but never defined (see the help page).
^ abCite error: The named reference WFG2003 was invoked but never defined (see the help page).
^Cite error: The named reference GMS+1999 was invoked but never defined (see the help page).
^Cite error: The named reference LHM+2010 was invoked but never defined (see the help page).
^Cite error: The named reference KGH+2010 was invoked but never defined (see the help page).
Anodicbonding is a wafer bonding process to seal glass to either silicon or metal without introducing an intermediate layer; it is commonly used to seal...
reduced performance, such as relatively low resonating frequency. In anodicbonding, wafers are sealed at high temperature and in the presence of electric...
effects. Anodizing is also used to prevent galling of threaded components and to make dielectric films for electrolytic capacitors. Anodic films are...
metal so that some areas will become anodic (oxidation) and some cathodic (reduction). Electrons flow from the anodic areas into the electrolyte as the metal...
low temperature bonding technique, as opposed to fusion bonding. It is also less processing intensive than glass-to-glass anodicbonding, which requires...
wafer also have been created (SCREAM). Bonding a second wafer by glass frit bonding, anodicbonding or alloy bonding is used to protect the MEMS structures...
coating there will be a large cathode area and a very small anode area, and for the exposed anodic area the corrosion rate will be correspondingly high. Using...
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It...
Further, the bonding has less restrictions, concerning substrate roughness and planarity than direct bonding. Compared to anodicbonding, no high voltages...
characterization of wafer-level encapsulation applied on silicon to LTCC anodicbonding". Journal of Micromechanics and Microengineering. 20 (6): 064020. Bibcode:2010JMiMi...
Loop Heat Pipes PARAMETRIC EXPLORATION OF AUTOMATED FABRICATION AND ANODICBONDING OF CPS FOR LHP APPLICATIONS Loop heat pipes, two phase thermal management...
the anodic current. Written as a reduction, cathodic current is positive. The net current density is the difference between the cathodic and anodic current...
will gain electrons to form negatively charged ions. Ionic bonding is a kind of chemical bonding that arises from the mutual attraction of oppositely charged...
Titanium adhesive bonding is an engineering process used in the aerospace industry, medical-device manufacture and elsewhere. Titanium alloy is often...
very similar to the one used for Anodicbonding, where the recorded electric field bonds the glass sample to the anode. In thermal poling, one exploits...
iron is oxidized. Attempts to save a metal from becoming anodic are of two general types. Anodic regions dissolve and destroy the structural integrity of...
Melody Maker (with the 1962–onwards double cut-away), with a unique stepped anodized aluminum fingerboard instead of traditional frets. Pickup switching, volume...
oxygen is evolved at the anode, the total reaction is: CO2 + OH− → HCO−2 + 1/2 O2 Cathodic reduction of carbon dioxide and anodic oxidation of acetonitrile...
high (>2 V vs. Mg/Mg2+) anodic voltage stability limit. In that work, however, a low voltage (and somewhat expensive) anode material (chevrel-type Mo6S8)...
dissociate ions in salts and bond to other polar substances such as alcohols and acids, thus dissolving them. Its hydrogen bonding causes its many unique properties...
processes which bond without melting, such as pressure, cold welding, and diffusion bonding. Metal welding is distinct from lower temperature bonding techniques...
In order to achieve this, the anodic peaks are calculated and analyzed with the knowledge that the first and third anodic peaks can be assigned to the...
using a work up in the presence of hydrochloric acid and various alcohols. Anodic oxidation of methyl ketones leading to methyl esters. Interesterification...
1 M KOH-fed, respectively. Electrolyte can be fed on both anode and cathode side or anode side only. In the zero-gap design of AWE, the electrodes are...
single covalent bond from the saturated carbon atom to the iron atom. However, that structure was inconsistent with then-existing bonding models and did...
Global Information