Vapor etching refers to a process used in the fabrication of Microelectromechanical systems (MEMS) and Nanoelectromechanical systems (NEMS). Sacrificial layers are isotropically etched using gaseous acids such as Hydrogen fluoride and Xenon difluoride to release the free standing components of the device.
Economic advantages and novel technological possibilities result from micron to nano scale size reductions. (MEMS to NEMS) The small dimensions make the use of isotropic wet etch processes traditionally used in micro fabrication suffer from stiction, the permanent adherence of the free standing structure to the underlying substrate due to the scaling of surface effects occurring during the drying of the acid.[1] Vapor etching overcomes stiction because no liquids are used during the etch process. Commonly, hydrogen fluoride and xenon difluorides are used to etch silicon dioxide and silicon sacrificial layers respectively.
^Zhuang, Y.X.; Menon, A. (June 2005). "On the stiction of MEMS materials". Tribology Letters. 19 (2): 111–117. doi:10.1007/s11249-005-5088-1. ISSN 1023-8883. S2CID 49385010.
Vaporetching refers to a process used in the fabrication of Microelectromechanical systems (MEMS) and Nanoelectromechanical systems (NEMS). Sacrificial...
Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge (plasma) of an...
material is sputtered or dissolved using reactive ions or a vapor phase etchant. Wet chemical etching consists of the selective removal of material by dipping...
Atomic layer etching (ALE) is an emerging technique in semiconductor manufacture, in which a sequence alternating between self-limiting chemical modification...
utilised in science and industry—there, it is used to perform precise etching, carry out analytical techniques, and deposit thin film layers in the manufacture...
industries. A variety of ion beam sources exists, some derived from the mercury vapor thrusters developed by NASA in the 1960s. The most common ion beams are...
etch-resistant layer on the backside of the stencil for etching (if the membrane material is sensitive to the etching process) or a conductive layer on the backside...
from the plasma in the plasma afterglow. Chemical vapor deposition Corona treatment Physical vapor deposition Plasma activation Plasma chemistry Plasma...
removed. Etching techniques include: Dry etching (plasma etching) such as reactive-ion etching (RIE) or deep reactive-ion etching (DRIE) Wet etching or chemical...
referred to as "multiple pulsed vapor-phase infiltration" (MPI), "vapor phase infiltration" (VPI)” or "sequential vapor infiltration" (SVI)". Although...
development, the pattern is transferred onto the substrate through etching, chemical vapor deposition, or ion implantation processes. Ultraviolet (UV) light...
semiconductor industry to form tungsten films, through the process of chemical vapor deposition. This layer is used in a low-resistivity metallic "interconnect"...
ASM's technologies include atomic layer deposition, epitaxy, chemical vapor deposition and diffusion. The company was founded by Arthur del Prado (1931-2016)...
Metal Assisted Chemical Etching (also known as MACE) is the process of wet chemical etching of semiconductors (mainly silicon) with the use of a metal...
per minute produce polycrystalline silicon, and negative growth rates (etching) may occur if too much hydrogen chloride byproduct is present. (Hydrogen...
most often formed from a silicon precursor by etching of a solid or through catalyzed growth from a vapor or liquid phase. Such nanowires have promising...
PFPEs along with a vapor–liquid equilibrium of 230 °C when mixed with the right composites make it a suitable candidate for vapor phase soldering technologies...
annealing. Surface cleaning may be performed by sputter-etching, chemical etching, reactive gas etching or ion milling. For example, the native oxide of silicon...
(2004). "Modeling and characterization of sacrificial polysilicon etching using vapor-phase xenon difluoride". 17th IEEE International Conference on Micro...
off the substrate, some features will be missing or damaged. Etching resistance Anti-etching is the ability of a photoresist to resist the high temperature...
semiconductor, but still much lower than a true insulator like glass). Wet etching of GaAs industrially uses an oxidizing agent such as hydrogen peroxide...
first MXene was reported in 2011. As-synthesized MXenes prepared via HF etching have an accordion-like morphology, which can be referred to as multi-layer...
circuitry pattern on the wafer in photolithography. There was also plasma etching, and products focused on wet surface preparation, using cleaning to remove...
Japan, and its product line can be divided into three categories: Plasma etching systems (RIE, ICP, DRIE) Plasma deposition systems (PECVD and LS-CVD®)...
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