Mechanical stress created by change in temperature of a material
Not to be confused with Thermal stress on humans.
In mechanics and thermodynamics, thermal stress is mechanical stress created by any change in temperature of a material. These stresses can lead to fracturing or plastic deformation depending on the other variables of heating, which include material types and constraints.[1] Temperature gradients, thermal expansion or contraction and thermal shocks are things that can lead to thermal stress. This type of stress is highly dependent on the thermal expansion coefficient which varies from material to material. In general, the greater the temperature change, the higher the level of stress that can occur. Thermal shock can result from a rapid change in temperature, resulting in cracking or shattering.
^Elements of metallurgy and engineering alloys. Campbell, F. C. (Flake C.). Materials Park, Ohio: ASM International. 2008. ISBN 9780871708670. OCLC 608624525.{{cite book}}: CS1 maint: others (link)
mechanics and thermodynamics, thermalstress is mechanical stress created by any change in temperature of a material. These stresses can lead to fracturing or...
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Thermal expansion is the tendency of matter to change its shape, area, volume, and density in response to a change in temperature, usually not including...
between thermalstress, temperature difference, coefficient of thermal expansion, and module dimensions. They found that the thermalstress was proportional...
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complexity parameter, the operating temperature and thermalstress curve, the part stress parameter and part stress curve, with arithmetic specified by the standard...
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S. (August 27, 2016). "Effect of thermalstress on fertility and egg quality of Japanese quail". Journal of Thermal Biology. 61: 38–43. doi:10.1016/j...
increases heating and thermalstress, while annealing reduces internal stress built into the glass during manufacturing. Thermal expansion creates internal...
residual stresses. Another example occurs during semiconductor fabrication and microsystem fabrication when thin film materials with different thermal and...
shock than any other common glass. Such glass is subjected to less thermalstress and can withstand temperature differentials without fracturing of about...
by temperature changes during a wildfire, through thermalstress weathering, may result in thermal shock and subsequent structure failure. Atmospheric...
much lower thermal conductivity and coefficient of linear expansion than aluminium. As a result, the coating will crack from thermalstress if exposed...
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difference in coefficient of thermal expansion between PCB substrate and BGA (thermalstress) or flexing and vibration (mechanical stress) can cause the solder...