List of integrated circuit packaging types information
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.
Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of different types of package exist. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers.
Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
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Pro Electron. Other types are proprietary designations that may be made by only one or two manufacturers. Integratedcircuitpackaging is the last assembly...
Integratedcircuitpackaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents...
same name. Listofintegratedcircuitpackagingtypes Small outline integratedcircuit Shrink Small Outline Package Mini Small Outline Package Small outline...
The first planar monolithic integratedcircuit (IC) chip was demonstrated in 1960. The idea of integrating electronic circuits into a single device was born...
A small outline integratedcircuit (SOIC) is a surface-mounted integratedcircuit (IC) package which occupies an area about 30–50% less than an equivalent...
markets are typically packaged in plastic. Listofintegratedcircuitpackagingtypes Kenneth Jackson, Wolfgang Schroter, (ed), Handbook of Semiconductor Technology...
semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integratedcircuits. Individual...
A pin grid array (PGA) is a typeofintegratedcircuitpackaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular...
A ball grid array (BGA) is a typeof surface-mount packaging (a chip carrier) used for integratedcircuits. BGA packages are used to permanently mount...
The soviet integratedcircuit designation is an industrial specification for encoding the names ofintegratedcircuits manufactured in the Soviet Union...
An integratedcircuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic...
processors, semiconductor memory, image sensors, and most other typesofintegratedcircuits. Discrete MOSFET devices are widely used in applications such...
used as elements of more complex integratedcircuits. The op amp is one typeof differential amplifier. Other differential amplifier types include the fully...
may be packaged discretely, as arrays or networks of like components, or integrated inside ofpackages such as semiconductor integratedcircuits, hybrid...
555 timer IC is an integratedcircuit used in a variety of timer, delay, pulse generation, and oscillator applications. It is one of the most popular timing...
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