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Chip carrier information


Intel 80186 in QFJ68 / PLCC68, an example of a plastic leaded chip carrier

In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounting the integrated circuit, the package overall size is large.[1]

  1. ^ Kenneth Jackson, Wolfgang Schroter, (ed), Handbook of Semiconductor Technology Volume 2, Wiley VCH, 2000, ISBN 3-527-29835-5, page 627

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Chip carrier

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electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections...

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Integrated circuit

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An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic...

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List of integrated circuit packaging types

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direct connections to a substrate without an intermediate header or carrier. In flip chip systems the IC is connected by solder bumps to a substrate. In beam-lead...

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Flip chip

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system. The resulting completed flip chip assembly is much smaller than a traditional carrier-based system; the chip sits directly on the circuit board...

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Processor design

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fabrication processes, resulting in a die which is bonded onto a chip carrier. This chip carrier is then soldered onto, or inserted into a socket on, a printed...

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Ball grid array

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount...

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Chip

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Look up CHIP, Chip, chip, Chips, or chips in Wiktionary, the free dictionary. Chip may refer to: Chip (snack), thin sliced food, cooked until crunchy...

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Pin grid array

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G2, and G3 sockets. Ball grid array (BGA) Centered square number Chip carrier - chip packaging and package types list Dual in-line package (DIP) Land...

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Integrated circuit packaging

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technology Surface-mount technology Chip carrier Pin grid array Flat package Small Outline Integrated Circuit Chip-scale package Ball grid array Transistor...

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Land grid array

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Emerald Rapids) socket LGA 7529 - Intel E-core Xeon (Sierra Forest) socket Chip carrier Dual in-line package (DIP) Pin grid array (PGA) Ball grid array (BGA)...

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CPU socket

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to be successfully routed to nearby components. Likewise, within the chip carrier, the wire bonding technology also becomes more demanding with increasing...

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System in a package

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system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package substrate that may include passive...

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Quad flat package

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printed circuit board (PCB). A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch)...

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Thin small outline package

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(SSOP) Thin-shrink small outline package (TSSOP) Integrated circuit Chip carrier Chip packaging and package types list Intel (1999). "Small Outline Package...

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Package

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enclosing or protecting products Mail, items larger than a letter Chip package or chip carrier Electronic packaging, in electrical engineering Automotive package...

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Motorola 68HC11

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eight bits wide except for D, which is six bits (in some variations of the chip, D also has eight bits). It can be operated with an internal program and...

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PLCC

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PLCC may refer to: Plastic leaded chip carrier Power-line carrier communication Pearson's linear correlation coefficient Private-label credit card This...

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Motorola 68000

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processes of the era, these were often multi-chip solutions like the National Semiconductor IMP-16, or the single-chip PACE that had issues with speed. With...

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Lead frame

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technology that allow improved thermal and electrical performance. Chip carrierChip packaging and package types list Electronic Materials Handbook: Packaging...

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Interposer

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"interpōnere", meaning "to put between". They are often used in BGA packages, multi-chip modules and high bandwidth memory. A common example of an interposer is an...

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Processor

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component with two or more independent CPUs (called "cores") on the same chip carrier or on the same die Front-end processor, a helper processor for communication...

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XSON

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XSON is a chip package and stands for "plastic eXtremely thin Small OutliNe package". It's a package where the chip is encapsulated in a block and on...

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