Global Information Lookup Global Information

Electronic packaging information


Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.

and 23 Related for: Electronic packaging information

Request time (Page generated in 0.9035 seconds.)

Electronic packaging

Last Update:

Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems...

Word Count : 1899

Packaging

Last Update:

packages. Packaging can be described as a coordinated system of preparing goods for transport, warehousing, logistics, sale, and end use. Packaging contains...

Word Count : 4728

Integrated circuit packaging

Last Update:

practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early...

Word Count : 1597

Electronic component

Last Update:

electronic circuit with a particular function (for example an amplifier, radio receiver, or oscillator). Basic electronic components may be packaged discretely...

Word Count : 2703

Package

Last Update:

Chip package or chip carrier Electronic packaging, in electrical engineering Automotive package, in automobile production and marketing Package holiday...

Word Count : 297

System in a package

Last Update:

Johnson, Mark Strickland and David Gerke, NASA Electronic Parts and Packaging Program. “3-D Packaging: A Technology Review.” June 23, 2005. Retrieved...

Word Count : 997

Schroff GmbH

Last Update:

nVent SCHROFF GmbH is a German manufacturer of electronic packaging products and segment of nVent. Its products include cabinets, housings, chassis and...

Word Count : 658

Chip on board

Last Update:

of integrated circuit leads. COB effectively merges two levels of electronic packaging: level 1 (components) and level 2 (wiring boards), and may be referred...

Word Count : 727

Physics of failure

Last Update:

major successes with physics of failure at the die-level, the component packaging community had four major successes arise from their work in the 1970s...

Word Count : 2295

Package on a package

Last Update:

Package on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two...

Word Count : 1352

Launch Vehicle Digital Computer

Last Update:

Owego, NY. "Mechanical and Electronic Packaging for a Launch-Vehicle Guidance Computer." International Electronic Circuit Packaging Symposium 21–24 August...

Word Count : 1617

List of waste management acronyms

Last Update:

EPERN Electronic Packaging Waste Export Recovery Notes EPOW European Pathway to Zero Waste EPR Environmental Permitting Regulations EPRN Electronic Packaging...

Word Count : 2946

Printed circuit board

Last Update:

delamination, the same effect responsible for "popcorning" damage on wet packaging of electronic parts. Careful baking of the substrates may be required to dry...

Word Count : 10936

Beth Keser

Last Update:

electronics engineer specializing in electronic packaging, and especially wafer-level packaging. She is head of Packaging & Systems Technology for Intel, and...

Word Count : 380

Glass

Last Update:

Electronic Packaging and Integration: High Q Inductances for 2.35 GHZ Impedance Matching in 0.05 mm Thin Glass Substrates". 2018 IEEE 68th Electronic...

Word Count : 9162

Electric current

Last Update:

2019, ISBN 978-92-822-2272-0 Blackwell, Glenn R. (2017-12-19). The Electronic Packaging Handbook. CRC Press. ISBN 978-1-351-83554-1. Singh, Kulwant (2023-08-30)...

Word Count : 4672

Disk cloning

Last Update:

2015 IEEE 21st International Symposium for Design and Technology in Electronic Packaging (SIITME). pp. 393–396. doi:10.1109/SIITME.2015.7342360. ISBN 978-1-5090-0332-7...

Word Count : 1484

Electrical enclosure

Last Update:

in hazardous areas, such as petrochemical plants or coal mines. Electronic packaging may place many demands on an enclosure for heat dissipation, radio...

Word Count : 785

Phased array

Last Update:

number of simultaneous beams is limited by practical reasons of electronic packaging of the beam formers to approximately three simultaneous beams for...

Word Count : 5023

Electronics

Last Update:

printed circuit board (PCB), to create an electronic circuit with a particular function. Components may be packaged singly, or in more complex groups as integrated...

Word Count : 3239

Journal of Electronic Materials

Last Update:

specific materials science involves transistors, nanotechnology, electronic packaging, detectors, emitters, metallization, superconductivity, and energy applications...

Word Count : 271

List of integrated circuit packaging types

Last Update:

board is a packaging technique that directly connects a die to a PCB, without an interposer or lead frame. A chip carrier is a rectangular package with contacts...

Word Count : 3406

Thermal contact conductance

Last Update:

fields where contact conductance is of importance are: Electronics Electronic packaging Heat sinks Brackets Industry Nuclear reactor cooling Gas turbine...

Word Count : 1266

PDF Search Engine © AllGlobal.net