Ways electronic components fail and prevention measures
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.
Failures most commonly occur near the beginning and near the ending of the lifetime of the parts, resulting in the bathtub curve graph of failure rates. Burn-in procedures are used to detect early failures. In semiconductor devices, parasitic structures, irrelevant for normal operation, become important in the context of failures; they can be both a source and protection against failure.
Applications such as aerospace systems, life support systems, telecommunications, railway signals, and computers use great numbers of individual electronic components. Analysis of the statistical properties of failures can give guidance in designs to establish a given level of reliability. For example, power-handling ability of a resistor may be greatly derated when applied in high-altitude aircraft to obtain adequate service life.
A sudden fail-open fault can cause multiple secondary failures if it is fast and the circuit contains an inductance; this causes large voltage spikes, which may exceed 500 volts. A broken metallisation on a chip may thus cause secondary overvoltage damage.[1] Thermal runaway can cause sudden failures including melting, fire or explosions.
^STFA 2001: proceedings of the 27th International Symposium for Testing and Failure Analysis: 11–15 November 2001, Santa Clara Convention Center, Santa Clara, California, p. 267 ISBN 0-87170-746-2
and 25 Related for: Failure of electronic components information
Electroniccomponents have a wide range offailure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by...
as integrated circuits. Passive electroniccomponents are capacitors, inductors, resistors, whilst active components are such as semiconductor devices;...
Prediction ofElectronic Equipment, is a military standard that provides failure rate data for many military electroniccomponents. Several failure rate data...
orbit (GEO). Orbits higher than low orbit can lead to early failureofelectroniccomponents due to intense radiation and charge accumulation. In 2017,...
Mean time between failures (MTBF) is the predicted elapsed time between inherent failuresof a mechanical or electronic system during normal system operation...
consisting of computer components and recording media that are used to retain digital data. It is a core function and fundamental componentof computers...
or electronicfailures within the ETC have been suspected by some to be responsible for alleged incidents of unintended acceleration. A series of investigations...
of electronic equipment, and it is essential during the design stage of engineering systems life cycle. Reliability is a measure of the frequency of equipment...
An electronic color code or electronic colour code (see spelling differences) is used to indicate the values or ratings ofelectroniccomponents, usually...
failureofelectroniccomponents in semiconductor chips and photovoltaic cells. Its sources are similar to those of TOC's. Depending on the level of purity...
Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic...
An electronic control unit (ECU), also known as an electronic control module (ECM), is an embedded system in automotive electronics that controls one or...
standards describe multiple MELF components. Because of their cylindrical shape and small size, in some cases these components can easily roll off the workbench...
value for the rate offailureof the mechanical and electroniccomponentsof a system. It is based upon the idea that the more components that there are in...
published by RCA and was used for the prediction offailure rates ofelectroniccomponents. The emphasis on component reliability and empirical research (e.g....
improvement of existing products. The failure analysis process relies on collecting failed components for subsequent examination of the cause or causes of failure...
Time). This is the number offailures that can be expected in one billion (109) component-hours of operation (e.g., 1000 components for 1 million hours, or...
example, a group of parallel blocks could require two out of three components to succeed for the system to succeed. By contrast, any failure along a series...
capacitor is an electrolytic capacitor, a passive componentofelectronic circuits. It consists of a pellet of porous tantalum metal as an anode, covered by...
Electronic voting is voting that uses electronic means to either aid or take care of casting and counting ballots. Depending on the particular implementation...
for each corner of the vehicle. Dunlop Systems and Components Ltd have continued to develop the products to the point where the Electronic Control Unit (ECU)...
Electronic voting by country varies and may include voting machines in polling places, centralized tallying of paper ballots, and internet voting. Many...
dangerous failure rate of a system, not just its failure rate or the failure rate of a component part, such as the software. Definition of the dangerous...
a small jolt of discomfort, but ESD can inflict severe damage on electroniccomponents, potentially leading to malfunctions and failures. In hazardous...
application of 6 February 1959, Kilby described his new device as "a body of semiconductor material ... wherein all the componentsof the electronic circuit...