Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman,[1] the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics.[2][3] Owing to the well proven reliability of thermosonic bonds, it is extensively used to connect the central processing units (CPUs), which are encapsulated silicon integrated circuits that serve as the "brains" of today's computers.
^Harman, G., Wire Bonding In Microelectronics, McGraw-Hill, Chapt. 2, pg.36, also search Coucoulas at https://www.amazon.com/WIRE-BONDING-MICROELECTRONICS-3-E/dp/0071476237/ref=sr_1_1?s=books&ie=UTF8&qid=1354948679&sr=1-1&keywords=wire+bonding+in+microelectronics#_ search Coucoulas
^Coucoulas, A., Trans. Metallurgical Society Of AIME, "Ultrasonic Welding of Aluminum Leads to Tantalum Thin Films", 1966, pp. 587–589. abstract https://sites.google.com/site/coucoulasthermosonicbondalta
^Coucoulas, A., "Hot Work Ultrasonic Bonding – A Method Of Facilitating Metal Flow By Restoration Processes", Proc. 20th IEEE Electronic Components Conf. Washington, D.C., May 1970, pp. 549–556.https://sites.google.com/site/hotworkultrasonicbonding
and 11 Related for: Thermosonic bonding information
Thermosonicbonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding"...
and strength of a wire bond. If heat and ultrasonic energy is used, the process is called thermosonicbonding. In wedge bonding, the wire must be drawn...
wafer and attached to their carriers, typically via wire bonding such as thermosonicbonding. These wires eventually lead to pins on the outside of the...
author. He was named "father of thermosonicbonding" by George Harman, the world's foremost authority on wire bonding, where he referenced Coucoulas's...
Shielding this radiating sound can be done using an acoustic enclosure. Thermosonicbonding Hiromichi T. Fujii, Yuta Goto, Yutaka S. Sato, and Hiroyuki Kokawa...
this type of bond are thermocompression bonding and thermosonicbonding. Both of these processes form the bonds with a hard faced bonding tool that makes...
highly dependent on the package type. IC bonding Wire bondingThermosonicBonding Down bonding Tape automated bonding Flip chip Quilt packaging Film attaching...
Thermocompression bonding describes a wafer bonding technique and is also referred to as diffusion bonding, pressure joining, thermocompression welding...
Netherlands – wind powered sawmill Alexander Coucoulas (born 1933), U.S. – Thermosonicbonding Wallace H. Coulter (1913–1998), U.S. – Coulter principle Jacques...
conductive paste or die attach film.) IC bonding: Wire bonding, thermosonicbonding, flip chip or tape automated bonding (TAB) IC encapsulation or integrated...
aluminium (or gold) bond wires which are thermosonically bonded to pads, usually found around the edge of the die. Thermosonicbonding was first introduced...
Global Information