This single-in-line package contains four resistors. Each resistor is connected to the first four respective pins, while the last pin is common to all of them
Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives,[1][2] and still the difference between integrated and embedded passives is technically unclear.[3][4] In both cases passives are realized in between dielectric layers or on the same substrate.
The earliest form of IPDs are resistor, capacitor, resistor-capacitor (RC) or resistor-capacitor-coil/inductor (RCL) networks. Passive transformers can also be realised as integrated passive devices like by putting two coils on top of each other separated by a thin dielectric layer. Sometimes diodes (PN, PIN, zener etc.) can be integrated on the same substrate with integrated passives specifically if the substrate is silicon or some other semiconductor like gallium arsenide (GaAs).[5][6]
^Lu, D.; Wong, C.P. (2017). Materials for Advanced Packaging,2nd edition. Springer, Chapter 13. pp. 537–588. ISBN 978-3-319-45098-8.
^Ulrich, R.K.; Scharper, L.W. (2003). Integrated Passive Component Technology. John Wiley & Sons. ISBN 978-0-471-24431-8.
^Webster, J.G. (1999). Wiley Encyclopedia on Electrical and Electronics Engineering. John Wiley & Sons. ISBN 9780471346081.
^Ulrich, R.K.; Scharper, L.W. (2003). Integrated Passive Component Technology. John Wiley & Sons. ISBN 978-0-471-24431-8.
^Lianjun Liu; Shun-Meen Kuo; Abrokwah, J.; Ray, M.; Maurer, D.; Miller, M. (2007). "Compact Harmonic Filter Design and Fabrication Using IPD Technology". IEEE Transactions on Components and Packaging Technologies. 30 (4): 556–562. doi:10.1109/TCAPT.2007.901672. S2CID 47545933.
^Kumar (2019). "Design Analysis of Integrated Passive Device-Based Balun Devices With High Selectivity for Mobile Application". IEEE Access. 7: 23169–23176. doi:10.1109/ACCESS.2019.2898513. S2CID 71150524.
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