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In nanotechnology, carbon nanotube interconnects refer to the proposed use of carbon nanotubes in the interconnects between the elements of an integrated circuit. Carbon nanotubes (CNTs) can be thought of as single atomic layer graphite sheets rolled up to form seamless cylinders. Depending on the direction on which they are rolled, CNTs can be semiconducting or metallic. Metallic carbon nanotubes have been identified[1] as a possible interconnect material for the future technology generations and to replace copper interconnects. Electron transport can go over long nanotube lengths, 1 μm, enabling CNTs to carry very high currents (i.e. up to a current density of 109 A∙cm−2) with essentially no heating due to nearly one dimensional electronic structure.[2] Despite the current saturation in CNTs at high fields,[2] the mitigation of such effects is possible due to encapsulated nanowires.[3]
Carbon nanotubes for interconnects application in Integrated chips have been studied since 2001,[4] however the extremely attractive performances of individual tubes are difficult to reach when they are assembled in large bundles necessary to make real via or lines in integrated chips. Two proposed approaches to overcome the to date limitations are either to make very tiny local connections that will be needed in future advanced chips or to make carbon metal composite structure that will be compatible with existing microelectronic processes.
Hybrid interconnects that employ CNT vias in tandem with copper interconnects may offer advantages in reliability and thermal-management.[5] In 2016, the European Union has funded a four million euro project over three years to evaluate manufacturability and performance of composite interconnects employing both CNT and copper interconnects. The project named CONNECT (CarbON Nanotube compositE InterconneCTs)[6] involves the joint efforts of seven European research and industry partners on fabrication techniques and processes to enable reliable carbon nanotubes for on-chip interconnects in ULSI microchip production.
^ abPark, Ji-Yong; Rosenblatt, Sami; Yaish, Yuval; Sazonova, Vera; Üstünel, Hande; Braig, Stephan; Arias, T. A.; Brouwer, Piet W.; McEuen, Paul L. (2004). "Electron−Phonon Scattering in Metallic Single-Walled Carbon Nanotubes". Nano Letters. 4 (3). American Chemical Society (ACS): 517–520. arXiv:cond-mat/0309641. Bibcode:2004NanoL...4..517P. doi:10.1021/nl035258c. ISSN 1530-6984. S2CID 32640167.
^Vasylenko, Andrij; Wynn, Jamie; Medeiros, Paulo V. C.; Morris, Andrew J.; Sloan, Jeremy; Quigley, David (2017-03-27). "Encapsulated nanowires: Boosting electronic transport in carbon nanotubes". Physical Review B. 95 (12): 121408. arXiv:1611.04867. Bibcode:2017PhRvB..95l1408V. doi:10.1103/PhysRevB.95.121408. S2CID 59023024.
^Wei, B. Q.; Vajtai, R.; Ajayan, P. M. (20 August 2001). "Reliability and current carrying capacity of carbon nanotubes". Applied Physics Letters. 79 (8). AIP Publishing: 1172–1174. Bibcode:2001ApPhL..79.1172W. doi:10.1063/1.1396632. ISSN 0003-6951.
^Chai, Yang; Chan, Philip C. H. (2008). "High electromigration-resistant copper/carbon nanotube composite for interconnect application". 2008 IEEE International Electron Devices Meeting. IEEE. pp. 1–4. doi:10.1109/iedm.2008.4796764. ISBN 978-1-4244-2377-4.
^"CORDIS | European Commission".
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In nanotechnology, carbonnanotubeinterconnects refer to the proposed use of carbonnanotubesin the interconnects between the elements of an integrated...
of composite interconnects employing both CNT and copper interconnects. The project named CONNECT (CarbONNanotube compositE InterconneCTs) involves the...
where for copper interconnects, current densities are limited by electromigration. Carbonnanotubes are thus being explored as interconnects and conductivity-enhancing...
In semiconductor technology, copper interconnects are interconnects made of copper. They are used in silicon integrated circuits (ICs) to reduce propagation...
nanotube has a bandgap (semiconducting) or no bandgap (metallic). Metallic carbonnanotubes have also been proposed for nanoelectronic interconnects since...
Carbon Fiber Electronic Interconnects (PDF) (Thesis). Archived (PDF) from the original on 2019-04-04. Retrieved 2017-03-02. "High Performance Carbon Fibers"...
type of bonding seen incarbonnanotubes and polycyclic aromatic hydrocarbons, and (partially) in fullerenes and glassy carbon. The valence band is touched...
(October 11, 2017). "Elastic properties of noncarbon nanotubes as compared to carbonnanotubes". Physical Review B. 96 (15): 155428. Bibcode:2017PhRvB...
exhibit structures analogous to various allotropes of carbon, including graphite, diamond, and nanotubes. In the diamond-like structure, called cubic boron nitride...
cutting nanotubes. In one such method multi-walled carbonnanotubes were unzipped in solution by action of potassium permanganate and sulfuric acid. In another...
Phaedon Avouris, Nanotubes and the Electronics of the Future, Scientific American 283, 38 (2000) Interconnect technologies using CarbonNanotubes: Current status...
by coating the sand with carbon. In 2012, Ajayan's group developed a macro-scale carbonnanotube sponge, in which nanotubes are covalently connected each...
entanglement of the interconnects, which oppose the movement of the device above the substrate, causes the spiral interconnects to stretch and deform...
(MRAM), Intel's 3D XPoint (discontinued in 2022), Nano-RAM based on carbonnanotubes. The goal of this technology is able to scale cost-effectively scale...
October 4, 2015). Cirillo, G.; Hampel, S.; Spizzirri, U. CarbonNanotubes Hybrid Hydrogels in Drug Delivery: A Perspective Review. Biomed Research International...
peculiar electrical properties due to their size. Unlike single wall carbonnanotubes, whose motion of electrons can fall under the regime of ballistic transport...
moving parts, can be mixed with carbonnanotubes and epoxies in the construction of telescope mirrors up to 50 meters in diameter. Several craters near...
multi-layer graphene interconnects is lower than that of copper and carbonnanotubes (CNTs). Moreover, as high as 32 and 50% improvements in quality-factor...
substrate. Nano-channels can also be fabricated from the growth of carbonnanotubes (CNT) and quantum wires. The bottom-up methods usually give well-defined...
E ~ ρ2, compared to E ~ ρ3 in aerogels and carbonnanotube foams. Metallic microlattice may find potential applications in thermal and vibration insulators...
The wafers up to 300 mm in diameter (wider than a common dinner plate). As of 2022[update], 5 nm transistors. Copper interconnects where copper wiring replaces...
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