Quickly heats semiconductor wafers to high temperatures
Rapid thermal processing (RTP) is a semiconductor manufacturing process which heats silicon wafers to temperatures exceeding 1,000°C for not more than a few seconds. During cooling wafer temperatures must be brought down slowly to prevent dislocations and wafer breakage due to thermal shock. Such rapid heating rates are often attained by high intensity lamps or lasers. These processes are used for a wide variety of applications in semiconductor manufacturing including dopant activation, thermal oxidation, metal reflow and chemical vapor deposition.[1]
^Lynn Fuller (March 27, 2010). "Rapid Thermal Processing (RTP)" (PDF). Rochester Institute of Technology.
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ISBN 978-0-471-57481-1. US 4771016, Bajor, George & et al., "Using a rapidthermalprocess for manufacturing a wafer bonded soi semiconductor", issued 1988-09-13 ...
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