Not to be confused with Compact Modular Architecture platform.
Motor vehicle platform
Common Modular Platform
The DS 3 (formerly DS 3 Crossback) was the first vehicle to have this platform.
Overview
Manufacturer
Stellantis
Also called
EMP1[1]
Production
2018–present
Body and chassis
Class
Subcompact car/supermini (B-segment)
Compact car/small family car (C-segment)
Layout
Front-engine, front-wheel-drive
Front-motor, front-wheel-drive (eCMP)
Front-engine, all-wheel-drive (Jeep)
Dual-motor, all-wheel-drive (eCMP, Jeep)
Chronology
Predecessor
PSA PF1 platform
SCCS platform
General Motors Gamma platform
Common Modular Platform (CMP)[2] is a modular car platform which is jointly developed and used by French car manufacturer PSA Group (merged into Stellantis since 2021) and Chinese car manufacturer Dongfeng.[3] Debuted in 2018 with the release of the DS 3 (formerly DS 3 Crossback),[3] the platform is mainly used by B-segment (supermini or subcompact) vehicles along with some entry level C-segment vehicles.[3][4] For larger cars from the C-segment above, PSA/Stellantis uses the Efficient Modular Platform (EMP2).[5]
The CMP offers a high level of modularity with a choice of two track widths, three wheelbase lengths, three rear modules and the capability to offer several wheel diameters, allowing engineers and designers to provide to introduce broad range of body styles, from hatchbacks and saloons to SUVs.[3] It has been extended for battery-electric vehicles as e-CMP and e-CMP2.
^"PSA plans joint small-car platform with Dongfeng". Automotive News Europe. 2015-04-15. Retrieved 2022-09-14.
^"CMP: The New Modular, Multi-energy Platform for Groupe PSA". groupe-psa.com. Retrieved 25 December 2018.
^ abcd"PSA reveals common modular platform for future models". Autocar Professional India. Retrieved 2022-09-14.
^"Modular Multi-Energy Platforms: For Efficient Variety of Models". Stellantis Media. 2018-06-13. Retrieved 2022-09-14.
^"In diesem SUV steckt die Elektro-Zukunft von PSA". motor-talk.de. 15 March 2018. Retrieved 15 March 2018.
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