Tiny integrated circuit with a well-defined function
A chiplet[1][2][3][4] is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on an interposer in a single package. A set of chiplets can be implemented in a mix-and-match "Lego-like" assembly. This provides several advantages over a traditional system on chip (SoC):
Reusable IP (intellectual property):[5] the same chiplet can be used in many different devices
Heterogeneous integration:[6] chiplets can be fabricated with different processes, materials, and nodes, each optimized for its particular function
Known good die:[7] chiplets can be tested before assembly, improving the yield of the final device.
Multiple chiplets working together in a single integrated circuit may be called a multi-chip module, hybrid IC, 2.5D IC, or an advanced package.
Chiplets may be connected with standards such as UCIe, bunch of wires (BoW), AIB, OpenHBI, and OIF XSR.[8][9] Chiplets not designed by the same company must be designed with interoperability in mind, a daunting task.[10]
The term was coined by University of California, Berkeley professor John Wawrzynek as a component of the RAMP Project (research accelerator for multiple processors) in 2006 [11][12] extension for the Department of Energy, as was RISC-V architecture.
Common examples include:
Intel Meteor Lake
AMD Ryzen based on Zen 2 and later architecture
NVidia H100
^Brookes (25 July 2021). "What Is a Chiplet?". How-To Geek. Retrieved 28 December 2021.
^"Chiplet". WikiChip. Retrieved 28 December 2021.
^Semi Engineering "Chiplets" Retrieved 5 December 2022
^Don Scansen, EE Times "Chiplets: A Short History Retrieved 5 December 2022
^Keeler. "Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)". DARPA. Retrieved 28 December 2021.
^Kenyon (6 April 2021). "Heterogeneous Integration and the Evolution of IC Packaging". EE Times Europe. Retrieved 28 December 2021.
^Bertin, Claude L.; Su, Lo-Soun; Van Horn, Jody (2001). "Known Good die (KGD)". Area Array Interconnection Handbook. SpringerLink. pp. 149–200. doi:10.1007/978-1-4615-1389-6_4. ISBN 978-1-4613-5529-8. Retrieved 7 October 2022.
^"Waiting for Chiplet Standards". 25 March 2021.
^"Is UCIe Really Universal?". 22 November 2022.
^"UCIe Goes Back to the Drawing Board". 22 February 2024.
^Patterson, D.A. (March 2006). "RAMP: Research accelerator for multiple processors - a community vision for a shared experimental parallel HW/SW platform". 2006 IEEE International Symposium on Performance Analysis of Systems and Software. pp. 1–. doi:10.1109/ISPASS.2006.1620784. ISBN 1-4244-0186-0.
^Wawrzynek, John (2015-05-01). "Accelerating Science Driven System Design With RAMP". UCB. doi:10.2172/1186854. OSTI 1186854.
A chiplet is a tiny integrated circuit (IC) that contains a well-defined subset of functionality. It is designed to be combined with other chiplets on...
Universal Chiplet Interconnect Express (UCIe) is an open specification for a die-to-die interconnect and serial bus between chiplets. It is co-developed...
50% with RDNA 3 and that the upcoming architecture would be built using chiplet packaging on a 5 nm process. A sneak preview for RDNA 3 was included towards...
Haswell released in 2014, a shift to an multi-chip module (MCM) style "chiplet" package design, and a further shrink to Taiwan Semiconductor Manufacturing...
showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. AMD CEO Lisa Su also said to expect more...
2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips...
2023. It is the first generation of Intel mobile processors to use a chiplet architecture which means that the processor is a multi-chip module. Tim...
the first generation of Intel server and workstation processors to use a chiplet design. Sapphire Rapids is part of the Eagle Stream server platform. In...
multiply-accumulate (MMA) instructions First consumer graphics card to be based on a chiplet design TSMC N5 for Graphics Compute Die (GCD) TSMC N6 for Memory Cache...
move to a modular, chiplet-based approach. Towards the end of 2017, Naffziger began to lead the AMD graphics team in bringing a chiplet architecture to graphics...
Semiconductor Engineering. "Chiplet". WikiChip. 28 February 2021. "To Keep Pace With Moore's Law, Chipmakers Turn to 'Chiplets'". Wired. 11 June 2018. Schodt...
eDRAM cache per chiplet shareable among all chiplets. Thus, a six-chiplet processor would have 48 MB of L3 eDRAM cache, while a 12-chiplet processor would...
and InFO (integrated fan-out), to combine multiple chiplets on a single interposer. The chiplets are interconnected by AMD’s Infinity Fabric, which enables...
architecture based on 7 nm process, first architecture designed around chiplet technology. AMD Zen 3 Family 19h – third generation Zen architecture in...
make secure embedded flash products. In 2023 Winbond joined the Universal Chiplet Interconnect Express Consortium. List of semiconductor fabrication plants...
and Chiplet Technology Selected to Build the Future of AI in Japan". Tenstorrent. 2024-02-27. Retrieved 2024-03-08. "Tenstorrent RISC-V and Chiplet Technology...
company's main competitor, AMD, introduced the Zen microarchitecture and a new chiplet-based design to critical acclaim. Since its introduction, AMD, once unable...
Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets". TechPowerUp. Retrieved January 5, 2023. AMD Provides More Ryzen 9 7950X3D...
can be stacked vertically or tiled horizontally, with techniques like chiplets or quilt packaging. SiPs connect the dies with standard off-chip wire bonds...
the performance of NoC is use wireless communication channels between chiplets — named wireless network on chip (WiNoC). In a multi-core system, connected...
and manufacture of chiplet packaging. The venture-backed company opened a $2 billion facility in Tampines in 2023 to produce chiplets for their customers...
Confirms Ryzen 9 7950X3D and 7900X3D Feature 3DV Cache on Only One of the Two Chiplets". TechPowerUp. Retrieved January 5, 2023. AMD Provides More Ryzen 9 7950X3D...
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